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MICRO USB 3.0 SMT Wire bond TYPE Male

 

Pitch:MICRO USB 3.0  SMT Wire bond TYPE Male

No.：186BML01-10XXXX

 

 

 

Specifications：

Current Rating：10.0Ampere
Insulation Resistance：500MΩ Min
Dielectric Withstanding：500V AC
Contact Resistance：30mΩ Max
Operating Temperature：-30℃ to +85℃

 

Materials:

Contact Material：Copper Alloy
Housing Material：Polyester,UL 94V-0；PA6T OR LCP, Color: Black
All materials must meet HoRS tequirement for environmention protection

 

 

 

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